SMT貼片指的(de)(de)(de)是在(zai)(zai)(zai)PCB基(ji)礎上(shang)進行(xing)加(jia)工(gong)(gong)的(de)(de)(de)系(xi)列工(gong)(gong)藝(yi)流程的(de)(de)(de)簡稱，PCB（PrintedCircuitBoard)為(wei)印(yin)刷電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)板(ban)(ban)。SMT是表(biao)(biao)面組裝技(ji)術(shu)(shu)（表(biao)(biao)面貼裝技(ji)術(shu)(shu)）（SurfaceMountedTechnology的(de)(de)(de)縮寫），是電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)組裝行(xing)業(ye)里當(dang)下(xia)流行(xing)的(de)(de)(de)一(yi)種(zhong)技(ji)術(shu)(shu)和(he)工(gong)(gong)藝(yi)。在(zai)(zai)(zai)通常情況(kuang)下(xia)我們用(yong)(yong)的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)產(chan)品都是由pcb加(jia)上(shang)各(ge)種(zhong)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)容，電(dian)(dian)(dian)(dian)(dian)(dian)(dian)阻等電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)元(yuan)器件按設計(ji)的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)圖設計(ji)而成的(de)(de)(de),所(suo)以形(xing)形(xing)色的(de)(de)(de)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)器需(xu)要各(ge)種(zhong)不(bu)同的(de)(de)(de)smt貼片加(jia)工(gong)(gong)工(gong)(gong)藝(yi)來加(jia)工(gong)(gong)。1943年，美國(guo)人多將該(gai)技(ji)術(shu)(shu)運用(yong)(yong)于(yu)收(shou)音機，1948年，美國(guo)正式(shi)認可(ke)此發(fa)明可(ke)用(yong)(yong)于(yu)商業(ye)用(yong)(yong)途(tu)。自20世紀50年代中(zhong)期起，印(yin)刷線路(lu)板(ban)(ban)才開始被(bei)廣運用(yong)(yong)。印(yin)刷電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)板(ban)(ban)幾乎會出現在(zai)(zai)(zai)每一(yi)種(zhong)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)設備當(dang)中(zhong)。如(ru)果在(zai)(zai)(zai)某樣設備中(zhong)有電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)零件，那么它們也都是鑲在(zai)(zai)(zai)大(da)小(xiao)各(ge)異的(de)(de)(de)PCB上(shang)。PCB的(de)(de)(de)主(zhu)要功(gong)能是使(shi)各(ge)種(zhong)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)零組件形(xing)成預定電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)的(de)(de)(de)連(lian)接(jie)，起中(zhong)繼傳(chuan)輸的(de)(de)(de)作用(yong)(yong)，是電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)產(chan)品的(de)(de)(de)關鍵(jian)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)互連(lian)件，有“電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子(zi)(zi)(zi)(zi)產(chan)品之母”之稱。SMT貼片加(jia)工(gong)(gong)散料該(gai)如(ru)何(he)處理?河北電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)板(ban)(ban)SMT貼片代工(gong)(gong)

SMT貼(tie)(tie)片(pian)機(ji)的(de)(de)常(chang)(chang)用(yong)知識大全：1.一般來說,SMT車間規定的(de)(de)溫(wen)(wen)度(du)(du)為(wei)25±3℃。2.錫(xi)(xi)膏(gao)(gao)印(yin)刷(shua)時,所(suo)需準備的(de)(de)材料及工具(ju)錫(xi)(xi)膏(gao)(gao)、鋼板﹑刮刀(dao)﹑擦拭紙(zhi)、無塵紙(zhi)﹑清洗劑﹑攪拌(ban)刀(dao)。3.一般常(chang)(chang)用(yong)的(de)(de)錫(xi)(xi)膏(gao)(gao)合金成(cheng)(cheng)份(fen)為(wei)Sn/Pb合金,且合金比(bi)例(li)為(wei)63/37。4.錫(xi)(xi)膏(gao)(gao)中主要成(cheng)(cheng)份(fen)分(fen)(fen)為(wei)兩大部(bu)分(fen)(fen)錫(xi)(xi)粉(fen)和助焊(han)劑。5.助焊(han)劑在焊(han)接中的(de)(de)主要作用(yong)是去除氧化物﹑破壞(huai)融錫(xi)(xi)表面張力﹑防止(zhi)再度(du)(du)氧化。6.錫(xi)(xi)膏(gao)(gao)中錫(xi)(xi)粉(fen)顆粒與Flux(助焊(han)劑)的(de)(de)體(ti)積之(zhi)比(bi)約(yue)為(wei)1:1,重(zhong)量之(zhi)比(bi)約(yue)為(wei)9:1。7.錫(xi)(xi)膏(gao)(gao)的(de)(de)取用(yong)原(yuan)則是先(xian)進(jin)先(xian)出。8.錫(xi)(xi)膏(gao)(gao)在開(kai)封使(shi)用(yong)時,須(xu)經過(guo)兩個重(zhong)要的(de)(de)過(guo)程回(hui)溫(wen)(wen)﹑攪拌(ban)。9.鋼板常(chang)(chang)見的(de)(de)制作方法為(wei)﹕蝕刻﹑激光(guang)﹑電鑄(zhu)。(或mounting)technology,中文意(yi)思為(wei)表面粘著(或貼(tie)(tie)裝(zhuang))技(ji)術。。12.制作SMT設(she)備程序時,程序中包括(kuo)五(wu)大部(bu)分(fen)(fen),此(ci)五(wu)部(bu)分(fen)(fen)為(wei)PCBdata;Markdata;Feederdata;Nozzledata;Partdata。13.無鉛(qian)焊(han)錫(xi)(xi)Sn/Ag/。14.零件干燥箱的(de)(de)管制相對(dui)溫(wen)(wen)濕度(du)(du)為(wei)<百(bai)分(fen)(fen)之(zhi)十。石家莊PCBASMT貼(tie)(tie)片(pian)貼(tie)(tie)裝(zhuang)SMT貼(tie)(tie)片(pian)機(ji)拋料問題分(fen)(fen)析及處理。

SMT貼片加工工藝印(yin)刷(shua)作業(ye)時需(xu)要(yao)注意事項(xiang):(1)刮(gua)(gua)刀:刮(gua)(gua)刀質(zhi)(zhi)材采用(yong)鋼(gang)刮(gua)(gua)刀,有(you)利于印(yin)刷(shua)在(zai)PAD上(shang)的錫膏成(cheng)型和(he)(he)脫膜。刮(gua)(gua)刀角度(du)(du):人(ren)工印(yin)刷(shua)為45-60度(du)(du);機(ji)器印(yin)刷(shua)為60度(du)(du)。印(yin)刷(shua)速度(du)(du):人(ren)工30-45mm/min;印(yin)刷(shua)機(ji)40mm-80mm/min。印(yin)刷(shua)環境:溫度(du)(du)在(zai)23±3℃,相對濕度(du)(du)45%-65%RH。(2)鋼(gang)網(wang):鋼(gang)網(wang)開(kai)孔(kong)根(gen)據產品的要(yao)求選擇鋼(gang)網(wang)的厚度(du)(du)和(he)(he)開(kai)孔(kong)的形狀、比例。QFP\CHIP:中心間距小于0。5mm和(he)(he)0402的CHIP需(xu)用(yong)激光開(kai)孔(kong)。檢測鋼(gang)網(wang):要(yao)每周(zhou)進(jin)行一(yi)次鋼(gang)網(wang)的張力測試,張力值(zhi)要(yao)求在(zai)35N/cm以上(shang)。清潔鋼(gang)網(wang):在(zai)連續印(yin)刷(shua)5-10片PCB板時,要(yao)用(yong)無塵擦網(wang)紙(zhi)擦拭(shi)一(yi)次。不(bu)使用(yong)碎布。(3)清潔劑(ji):IPA溶劑(ji):清潔鋼(gang)網(wang)時采用(yong)IPA和(he)(he)酒(jiu)精溶劑(ji),不(bu)能(neng)使用(yong)含氯成(cheng)份(fen)的溶劑(ji),因(yin)為會破壞錫膏的成(cheng)份(fen),影響(xiang)整個品質(zhi)(zhi)。

SMT工(gong)(gong)藝(yi)(yi)主(zhu)要(yao)包括錫膏(gao)印(yin)刷(shua)、貼(tie)(tie)片(pian)(pian)、回(hui)流焊等(deng)環(huan)節，每(mei)個環(huan)節都對終產(chan)品的(de)(de)質量(liang)和(he)(he)(he)(he)性(xing)(xing)能產(chan)生重(zhong)要(yao)影(ying)響。錫膏(gao)印(yin)刷(shua)是SMT工(gong)(gong)藝(yi)(yi)的(de)(de)首步，負責將(jiang)錫膏(gao)精確(que)地印(yin)刷(shua)到(dao)PCB的(de)(de)焊盤上。錫膏(gao)印(yin)刷(shua)的(de)(de)質量(liang)直接(jie)(jie)影(ying)響到(dao)后(hou)續貼(tie)(tie)片(pian)(pian)和(he)(he)(he)(he)回(hui)流焊的(de)(de)效果(guo)，因(yin)此需要(yao)嚴格控制錫膏(gao)的(de)(de)質量(liang)、印(yin)刷(shua)厚度(du)(du)、精度(du)(du)等(deng)參(can)數(shu)(shu)。在錫膏(gao)印(yin)刷(shua)過(guo)(guo)程(cheng)中，應(ying)選擇合(he)適的(de)(de)印(yin)刷(shua)設(she)(she)(she)備、鋼網和(he)(he)(he)(he)刮刀，以保(bao)證印(yin)刷(shua)效果(guo)的(de)(de)穩定性(xing)(xing)和(he)(he)(he)(he)可(ke)靠(kao)性(xing)(xing)。貼(tie)(tie)片(pian)(pian)是SMT工(gong)(gong)藝(yi)(yi)中將(jiang)元(yuan)(yuan)(yuan)器件(jian)貼(tie)(tie)裝(zhuang)(zhuang)到(dao)PCB上的(de)(de)過(guo)(guo)程(cheng)。貼(tie)(tie)片(pian)(pian)過(guo)(guo)程(cheng)中需要(yao)注意元(yuan)(yuan)(yuan)器件(jian)的(de)(de)取(qu)料、定位和(he)(he)(he)(he)貼(tie)(tie)裝(zhuang)(zhuang)等(deng)環(huan)節，確(que)保(bao)元(yuan)(yuan)(yuan)器件(jian)正確(que)地貼(tie)(tie)裝(zhuang)(zhuang)到(dao)預定位置。貼(tie)(tie)片(pian)(pian)機的(de)(de)性(xing)(xing)能、精度(du)(du)和(he)(he)(he)(he)穩定性(xing)(xing)對貼(tie)(tie)片(pian)(pian)效果(guo)有很(hen)大影(ying)響，因(yin)此選擇合(he)適的(de)(de)貼(tie)(tie)片(pian)(pian)機和(he)(he)(he)(he)優化貼(tie)(tie)片(pian)(pian)參(can)數(shu)(shu)至關重(zhong)要(yao)。回(hui)流焊是SMT工(gong)(gong)藝(yi)(yi)中將(jiang)錫膏(gao)熔化并使元(yuan)(yuan)(yuan)器件(jian)與PCB焊盤連接(jie)(jie)的(de)(de)過(guo)(guo)程(cheng)。回(hui)流焊過(guo)(guo)程(cheng)中，需要(yao)控制加熱速率、溫度(du)(du)曲線和(he)(he)(he)(he)冷卻速率等(deng)參(can)數(shu)(shu)，以保(bao)證焊點的(de)(de)質量(liang)和(he)(he)(he)(he)可(ke)靠(kao)性(xing)(xing)。回(hui)流焊設(she)(she)(she)備的(de)(de)性(xing)(xing)能、穩定性(xing)(xing)和(he)(he)(he)(he)溫度(du)(du)控制能力對回(hui)流焊效果(guo)至關重(zhong)要(yao)。在實際操作中，應(ying)根據(ju)元(yuan)(yuan)(yuan)器件(jian)和(he)(he)(he)(he)PCB的(de)(de)特性(xing)(xing)，選擇合(he)適的(de)(de)回(hui)流焊設(she)(she)(she)備和(he)(he)(he)(he)工(gong)(gong)藝(yi)(yi)參(can)數(shu)(shu)。SMT貼(tie)(tie)片(pian)(pian)太陽能板你了解嗎?

SMT貼片加(jia)(jia)(jia)工(gong)(gong)常見品質問(wen)題(ti)包(bao)括漏(lou)件(jian)、側件(jian)、翻件(jian)、元(yuan)件(jian)偏(pian)位(wei)、元(yuan)件(jian)損耗等。接下(xia)來為大家介紹SMT貼片加(jia)(jia)(jia)工(gong)(gong)常見品質問(wen)題(ti)及解決方法。SMT貼片加(jia)(jia)(jia)工(gong)(gong)漏(lou)件(jian)常見原(yuan)因：1.部件(jian)吸(xi)嘴(zui)氣道(dao)堵(du)塞(sai)，吸(xi)嘴(zui)損壞(huai)，吸(xi)嘴(zui)高度不(bu)(bu)正確；2.SMT設備的(de)真(zhen)空氣路(lu)被(bei)打破并堵(du)塞(sai)；3.電路(lu)板庫(ku)存不(bu)(bu)足(zu)，變形嚴(yan)重；4.線路(lu)板的(de)焊盤上(shang)沒有(you)焊膏或(huo)(huo)焊膏過(guo)少；5.零件(jian)質量問(wen)題(ti)，同一品種厚度不(bu)(bu)一致(zhi)；6.在(zai)(zai)SMT加(jia)(jia)(jia)工(gong)(gong)中(zhong)(zhong)使用的(de)SMT調用程(cheng)序存在(zai)(zai)誤差和(he)遺漏(lou)，或(huo)(huo)者在(zai)(zai)編程(cheng)中(zhong)(zhong)組件(jian)厚度參數的(de)選擇存在(zai)(zai)誤差；7.人為因素(su)在(zai)(zai)不(bu)(bu)經意(yi)間被(bei)觸動。在(zai)(zai)PCB生產過(guo)程(cheng)中(zhong)(zhong)SMT具體指(zhi)什么?北京(jing)電路(lu)板SMT貼片貼裝(zhuang)

SMT工(gong)藝(yi)特點及詳(xiang)細生(sheng)產工(gong)藝(yi)流程。河北電(dian)路板SMT貼片代工(gong)

SMT貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)機在線(xian)(xian)編(bian)程(cheng)(cheng)，對于(yu)已(yi)經完(wan)成離(li)線(xian)(xian)編(bian)程(cheng)(cheng)的(de)產品(pin)，可(ke)直接調出產品(pin)程(cheng)(cheng)序(xu)，對于(yu)沒有CAD坐(zuo)標(biao)文(wen)件(jian)的(de)產品(pin)，可(ke)采用在線(xian)(xian)編(bian)程(cheng)(cheng)。在線(xian)(xian)編(bian)程(cheng)(cheng)是(shi)在貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)機上人(ren)工(gong)(gong)輸入(ru)拾(shi)片(pian)(pian)(pian)(pian)(pian)和貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)程(cheng)(cheng)序(xu)的(de)過(guo)程(cheng)(cheng)。拾(shi)片(pian)(pian)(pian)(pian)(pian)程(cheng)(cheng)序(xu)完(wan)全由人(ren)工(gong)(gong)編(bian)制并輸入(ru)，貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)程(cheng)(cheng)序(xu)是(shi)通(tong)過(guo)教學攝像機對PCB上每個貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)元器(qi)(qi)件(jian)貼(tie)(tie)裝(zhuang)位置(zhi)(zhi)的(de)精(jing)確攝像，自動計(ji)算元器(qi)(qi)件(jian)中心坐(zuo)標(biao)（貼(tie)(tie)裝(zhuang)位置(zhi)(zhi)），并記錄到貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)程(cheng)(cheng)序(xu)表(biao)中，然(ran)后通(tong)過(guo)人(ren)工(gong)(gong)優(you)化而成。安(an)裝(zhuang)SMT貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)機供(gong)料器(qi)(qi)，1、按照離(li)線(xian)(xian)編(bian)程(cheng)(cheng)或在線(xian)(xian)編(bian)程(cheng)(cheng)編(bian)制的(de)拾(shi)片(pian)(pian)(pian)(pian)(pian)程(cheng)(cheng)序(xu)表(biao)，將各種元器(qi)(qi)件(jian)安(an)裝(zhuang)到貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)機的(de)料站(zhan)上。2、安(an)裝(zhuang)供(gong)料器(qi)(qi)時(shi)必須按照要(yao)求安(an)裝(zhuang)到位。3、安(an)裝(zhuang)完(wan)畢(bi)，必須由檢驗人(ren)員檢查，確保正確無誤(wu)后才能(neng)進行試貼(tie)(tie)和生產。河北電(dian)路板SMT貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)代工(gong)(gong)

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