隨著電子工業的(de)(de)飛速發(fa)展(zhan)和(he)(he)市場的(de)(de)激烈競(jing)爭，焊(han)(han)(han)料生(sheng)產(chan)(chan)(chan)企業都希望能(neng)(neng)生(sheng)產(chan)(chan)(chan)出焊(han)(han)(han)接(jie)(jie)性(xing)(xing)(xing)能(neng)(neng)優(you)(you)異、價(jia)格低廉的(de)(de)產(chan)(chan)(chan)品。助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)作為焊(han)(han)(han)膏(gao)(gao)的(de)(de)輔(fu)料（質(zhi)量(liang)分數(shu)為10%~20%），不僅可(ke)(ke)以提(ti)供(gong)(gong)優(you)(you)良的(de)(de)助(zhu)(zhu)焊(han)(han)(han)性(xing)(xing)(xing)能(neng)(neng)，而且還直接(jie)(jie)影(ying)響焊(han)(han)(han)膏(gao)(gao)的(de)(de)印刷性(xing)(xing)(xing)能(neng)(neng)和(he)(he)儲存壽命。免清(qing)洗(xi)(xi)(xi)(xi)(xi)型(xing)助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)是一種(zhong)不含鹵化物(wu)(wu)活性(xing)(xing)(xing)劑(ji)(ji)(ji)，焊(han)(han)(han)接(jie)(jie)后不需要清(qing)洗(xi)(xi)(xi)(xi)(xi)的(de)(de)新型(xing)助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)。使用(yong)這類助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)不但能(neng)(neng)節約對清(qing)洗(xi)(xi)(xi)(xi)(xi)設備和(he)(he)清(qing)洗(xi)(xi)(xi)(xi)(xi)溶劑(ji)(ji)(ji)的(de)(de)投入，而且還可(ke)(ke)減少(shao)廢(fei)氣(qi)和(he)(he)廢(fei)水(shui)的(de)(de)排放對環境帶來的(de)(de)污染，所以用(yong)免清(qing)洗(xi)(xi)(xi)(xi)(xi)型(xing)助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)替(ti)代傳統助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)具有重要的(de)(de)經濟效(xiao)(xiao)益和(he)(he)社(she)會效(xiao)(xiao)益。為此，國(guo)內外很多研(yan)究人員(yuan)進行了免清(qing)洗(xi)(xi)(xi)(xi)(xi)助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)產(chan)(chan)(chan)品的(de)(de)研(yan)制。上(shang)(shang)海(hai)微(wei)聯(lian)實業有限公司供(gong)(gong)應(ying)(ying)(ying)無助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)殘(can)(can)留(liu)樹脂(zhi)錫(xi)膏(gao)(gao)。樹脂(zhi)錫(xi)膏(gao)(gao)的(de)(de)特點是可(ke)(ke)以烘箱(xiang)固化，也可(ke)(ke)以過回流焊(han)(han)(han)，形成金屬間化合(he)物(wu)(wu)。樹脂(zhi)錫(xi)膏(gao)(gao)沒(mei)有殘(can)(can)留(liu)物(wu)(wu)腐蝕風(feng)險，低揮發(fa)性(xing)(xing)(xing)，適合(he)高可(ke)(ke)靠(kao)應(ying)(ying)(ying)用(yong)。上(shang)(shang)海(hai)微(wei)聯(lian)樹脂(zhi)錫(xi)膏(gao)(gao)提(ti)供(gong)(gong)無鉛合(he)金的(de)(de)解決方案，無助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)殘(can)(can)留(liu)腐蝕，用(yong)于(yu)(yu)MiniLED封裝，用(yong)于(yu)(yu)Flipchip倒(dao)裝焊(han)(han)(han)。上(shang)(shang)海(hai)微(wei)聯(lian)樹脂(zhi)錫(xi)膏(gao)(gao)提(ti)供(gong)(gong)高可(ke)(ke)靠(kao)性(xing)(xing)(xing)的(de)(de)應(ying)(ying)(ying)用(yong)解決方案，零(ling)助(zhu)(zhu)焊(han)(han)(han)劑(ji)(ji)(ji)殘(can)(can)留(liu)風(feng)險，用(yong)于(yu)(yu)高可(ke)(ke)靠(kao)性(xing)(xing)(xing)產(chan)(chan)(chan)品應(ying)(ying)(ying)用(yong)，替(ti)代傳統焊(han)(han)(han)錫(xi)膏(gao)(gao)。可(ke)(ke)以選擇多種(zhong)合(he)金，針對不同基材(cai)。庫存免洗(xi)(xi)(xi)(xi)(xi)零(ling)殘(can)(can)留(liu)錫(xi)膏(gao)(gao)生(sheng)產(chan)(chan)(chan)

在(zai)生產(chan)中，較多的(de)(de)焊(han)(han)劑殘(can)渣常會導致(zhi)在(zai)要實行電接觸的(de)(de)金(jin)屬表層上(shang)有過多的(de)(de)殘(can)留(liu)物(wu)(wu)覆蓋，這會妨(fang)礙(ai)電連接的(de)(de)建立，在(zai)電路密度(du)(du)日益(yi)增加的(de)(de)情況下，這個問(wen)題越發(fa)受到人(ren)們的(de)(de)關注。上(shang)海微(wei)聯(lian)(lian)樹脂錫膏(gao)(gao)(gao)提供無(wu)(wu)鉛合(he)金(jin)的(de)(de)解決(jue)方案(an)，無(wu)(wu)助焊(han)(han)劑殘(can)留(liu)腐(fu)蝕(shi)(shi)，用(yong)于MiniLED封(feng)裝(zhuang)，用(yong)于Flipchip倒(dao)裝(zhuang)焊(han)(han)。上(shang)海微(wei)聯(lian)(lian)樹脂錫膏(gao)(gao)(gao)提供高(gao)可靠性的(de)(de)應用(yong)解決(jue)方案(an)，零(ling)助焊(han)(han)劑殘(can)留(liu)風(feng)險，用(yong)于高(gao)可靠性產(chan)品應用(yong)，替代傳統焊(han)(han)錫膏(gao)(gao)(gao)。并且上(shang)海微(wei)聯(lian)(lian)的(de)(de)樹脂錫膏(gao)(gao)(gao)沒有殘(can)留(liu)物(wu)(wu)腐(fu)蝕(shi)(shi)風(feng)險，低揮(hui)發(fa)性，適合(he)高(gao)可靠應用(yong)。上(shang)海微(wei)聯(lian)(lian)實業的(de)(de)錫膏(gao)(gao)(gao)的(de)(de)特點(dian)(dian)：1，適合(he)倒(dao)裝(zhuang)芯片焊(han)(han)接，SMT工藝和(he)其它(ta)焊(han)(han)接應用(yong)。2，多種合(he)金(jin)的(de)(de)選擇，針對(dui)不同(tong)溫度(du)(du)和(he)基材(cai)。3，解決(jue)焊(han)(han)點(dian)(dian)二(er)次融化問(wen)題。4，焊(han)(han)點(dian)(dian)強度(du)(du)更(geng)高(gao)和(he)焊(han)(han)點(dian)(dian)保護更(geng)好。5，解決(jue)焊(han)(han)接空洞問(wen)題，殘(can)留(liu)問(wen)題，腐(fu)蝕(shi)(shi)問(wen)題。6，提供點(dian)(dian)膠和(he)印刷不同(tong)解決(jue)方案(an)。廣東制備免洗零(ling)殘(can)留(liu)錫膏(gao)(gao)(gao)免洗零(ling)殘(can)留(liu)錫膏(gao)(gao)(gao)常見的(de)(de)用(yong)途有哪些？上(shang)海微(wei)聯(lian)(lian)告訴您。

上(shang)海(hai)微(wei)(wei)聯實業有(you)(you)(you)限公司供(gong)(gong)(gong)應(ying)(ying)無(wu)助(zhu)焊(han)劑(ji)殘留樹(shu)(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)。樹(shu)(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)的(de)(de)(de)特(te)點是可(ke)(ke)以(yi)(yi)烘(hong)箱(xiang)固(gu)(gu)(gu)化(hua)(hua)(hua)，也可(ke)(ke)以(yi)(yi)過(guo)回(hui)流焊(han)，形成(cheng)(cheng)金(jin)屬間化(hua)(hua)(hua)合(he)物(wu)。樹(shu)(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)沒(mei)有(you)(you)(you)殘留物(wu)腐(fu)(fu)蝕(shi)風(feng)險(xian)(xian)，低揮發性(xing)(xing)，適合(he)高可(ke)(ke)靠應(ying)(ying)用。上(shang)海(hai)微(wei)(wei)聯樹(shu)(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)提供(gong)(gong)(gong)無(wu)鉛(qian)合(he)金(jin)的(de)(de)(de)解(jie)決(jue)方案，無(wu)助(zhu)焊(han)劑(ji)殘留腐(fu)(fu)蝕(shi)，用于(yu)(yu)MiniLED封裝，用于(yu)(yu)Flipchip倒(dao)裝焊(han)。上(shang)海(hai)微(wei)(wei)聯樹(shu)(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)提供(gong)(gong)(gong)高可(ke)(ke)靠性(xing)(xing)的(de)(de)(de)應(ying)(ying)用解(jie)決(jue)方案，零助(zhu)焊(han)劑(ji)殘留風(feng)險(xian)(xian)，用于(yu)(yu)高可(ke)(ke)靠性(xing)(xing)產(chan)品應(ying)(ying)用，替(ti)代(dai)傳(chuan)統焊(han)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)。環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)固(gu)(gu)(gu)化(hua)(hua)(hua)/凝(ning)(ning)固(gu)(gu)(gu)后(hou)，合(he)金(jin)層(ceng)外(wai)包耐溫環(huan)(huan)(huan)(huan)氧(yang)(yang)樹(shu)(shu)(shu)脂(zhi)(zhi)，因(yin)此(ci)進入下一道加熱(re)固(gu)(gu)(gu)化(hua)(hua)(hua)/凝(ning)(ning)固(gu)(gu)(gu)工藝時(shi)，可(ke)(ke)以(yi)(yi)選(xuan)擇同種合(he)金(jin)而(er)不(bu)必考慮重熔(rong)帶(dai)來失效的(de)(de)(de)問題(ti)，因(yin)此(ci)，環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)在(zai)應(ying)(ying)用時(shi)，給客(ke)戶帶(dai)來了(le)材料(liao)(liao)管理上(shang)的(de)(de)(de)便利，不(bu)容易有(you)(you)(you)“錯(cuo)誤材料(liao)(liao)”而(er)報廢的(de)(de)(de)風(feng)險(xian)(xian)；無(wu)需(xu)選(xuan)用多種合(he)金(jin)也給客(ke)戶在(zai)采購時(shi)帶(dai)來成(cheng)(cheng)本優勢；無(wu)需(xu)選(xuan)用溫度(du)(du)梯度(du)(du)合(he)金(jin)降低了(le)客(ke)戶在(zai)倉儲上(shang)的(de)(de)(de)額外(wai)投入。環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)由于(yu)(yu)環(huan)(huan)(huan)(huan)氧(yang)(yang)樹(shu)(shu)(shu)脂(zhi)(zhi)的(de)(de)(de)絕緣性(xing)(xing)，因(yin)此(ci)固(gu)(gu)(gu)化(hua)(hua)(hua)/凝(ning)(ning)固(gu)(gu)(gu)后(hou)，互連層(ceng)在(zai)應(ying)(ying)用端具有(you)(you)(you)各向異(yi)(yi)性(xing)(xing)，可(ke)(ke)以(yi)(yi)形成(cheng)(cheng)Z軸單(dan)向導(dao)電(dian)；因(yin)此(ci)環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)是各向異(yi)(yi)性(xing)(xing)導(dao)電(dian)膠ACP的(de)(de)(de)低成(cheng)(cheng)本替(ti)代(dai)方案環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)的(de)(de)(de)導(dao)熱(re)系數遠高于(yu)(yu)各向異(yi)(yi)性(xing)(xing)導(dao)電(dian)膠ACP環(huan)(huan)(huan)(huan)氧(yang)(yang)錫(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)(gao)(gao)固(gu)(gu)(gu)化(hua)(hua)(hua)/凝(ning)(ning)固(gu)(gu)(gu)層(ceng)比ACP固(gu)(gu)(gu)化(hua)(hua)(hua)層(ceng)具有(you)(you)(you)耐電(dian)壓、耐溫度(du)(du)、抗(kang)老化(hua)(hua)(hua)的(de)(de)(de)優良特(te)性(xing)(xing)。

普通型錫(xi)膏問題(ti)就(jiu)是焊(han)接(jie)后殘(can)(can)留(liu)較多,需(xu)要清(qing)洗(xi)(xi),工藝比(bi)較復雜,免清(qing)洗(xi)(xi)的就(jiu)是焊(han)接(jie)后殘(can)(can)留(liu)較少,可(ke)(ke)不(bu)用(yong)(yong)清(qing)洗(xi)(xi)。上海(hai)(hai)(hai)微(wei)聯(lian)實業(ye)的免洗(xi)(xi)零(ling)殘(can)(can)留(liu)錫(xi)膏提供(gong)(gong)高(gao)可(ke)(ke)靠(kao)(kao)性的應用(yong)(yong)解(jie)決(jue)(jue)方(fang)(fang)案(an),零(ling)助焊(han)劑殘(can)(can)留(liu)風(feng)險,用(yong)(yong)于高(gao)可(ke)(ke)靠(kao)(kao)性產(chan)(chan)品應用(yong)(yong),替(ti)代(dai)傳統焊(han)錫(xi)膏。上海(hai)(hai)(hai)微(wei)聯(lian)實業(ye)有限公司供(gong)(gong)應無(wu)助焊(han)劑殘(can)(can)留(liu)樹(shu)(shu)(shu)脂(zhi)錫(xi)膏。樹(shu)(shu)(shu)脂(zhi)錫(xi)膏的特點(dian)是可(ke)(ke)以烘箱固化,也可(ke)(ke)以過回流焊(han),形成金(jin)屬間(jian)化合物(wu)。樹(shu)(shu)(shu)脂(zhi)錫(xi)膏沒有殘(can)(can)留(liu)物(wu)腐(fu)蝕(shi)風(feng)險,低揮發性,適(shi)合高(gao)可(ke)(ke)靠(kao)(kao)應用(yong)(yong)。上海(hai)(hai)(hai)微(wei)聯(lian)樹(shu)(shu)(shu)脂(zhi)錫(xi)膏提供(gong)(gong)無(wu)鉛合金(jin)的解(jie)決(jue)(jue)方(fang)(fang)案(an),無(wu)助焊(han)劑殘(can)(can)留(liu)腐(fu)蝕(shi),用(yong)(yong)于MiniLED封裝,用(yong)(yong)于Flipchip倒裝焊(han)。上海(hai)(hai)(hai)微(wei)聯(lian)樹(shu)(shu)(shu)脂(zhi)錫(xi)膏提供(gong)(gong)高(gao)可(ke)(ke)靠(kao)(kao)性的應用(yong)(yong)解(jie)決(jue)(jue)方(fang)(fang)案(an),零(ling)助焊(han)劑殘(can)(can)留(liu)風(feng)險,用(yong)(yong)于高(gao)可(ke)(ke)靠(kao)(kao)性產(chan)(chan)品應用(yong)(yong),替(ti)代(dai)傳統焊(han)錫(xi)膏免清(qing)洗(xi)(xi)樹(shu)(shu)(shu)脂(zhi)錫(xi)膏，上海(hai)(hai)(hai)微(wei)聯(lian)。

上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)實業有限公司(si)供(gong)(gong)應(ying)無(wu)(wu)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)。樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)的(de)(de)(de)(de)特點是可(ke)(ke)(ke)(ke)以烘箱(xiang)固化，也可(ke)(ke)(ke)(ke)以過回流焊(han)(han)(han)，形成金(jin)(jin)屬間化合(he)(he)(he)物(wu)。樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)沒(mei)有殘(can)(can)留(liu)(liu)物(wu)腐(fu)蝕(shi)(shi)風險，低(di)揮(hui)發性，適(shi)合(he)(he)(he)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)應(ying)用(yong)(yong)(yong)(yong)(yong)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)提(ti)供(gong)(gong)無(wu)(wu)鉛(qian)合(he)(he)(he)金(jin)(jin)的(de)(de)(de)(de)解決方案(an)，無(wu)(wu)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)腐(fu)蝕(shi)(shi)，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)MiniLED封裝(zhuang)(zhuang)，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)Flipchip倒裝(zhuang)(zhuang)焊(han)(han)(han)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)提(ti)供(gong)(gong)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)性的(de)(de)(de)(de)應(ying)用(yong)(yong)(yong)(yong)(yong)解決方案(an)，零(ling)(ling)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)風險，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)性產品應(ying)用(yong)(yong)(yong)(yong)(yong)，替代傳統焊(han)(han)(han)錫(xi)(xi)(xi)(xi)膏(gao)(gao)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)實業有限公司(si)供(gong)(gong)應(ying)無(wu)(wu)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)。樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)的(de)(de)(de)(de)特點是可(ke)(ke)(ke)(ke)以烘箱(xiang)固化，也可(ke)(ke)(ke)(ke)以過回流焊(han)(han)(han)，形成金(jin)(jin)屬間化合(he)(he)(he)物(wu)。樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)沒(mei)有殘(can)(can)留(liu)(liu)物(wu)腐(fu)蝕(shi)(shi)風險，低(di)揮(hui)發性，適(shi)合(he)(he)(he)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)應(ying)用(yong)(yong)(yong)(yong)(yong)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)提(ti)供(gong)(gong)無(wu)(wu)鉛(qian)合(he)(he)(he)金(jin)(jin)的(de)(de)(de)(de)解決方案(an)，無(wu)(wu)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)腐(fu)蝕(shi)(shi)，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)MiniLED封裝(zhuang)(zhuang)，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)Flipchip倒裝(zhuang)(zhuang)焊(han)(han)(han)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)樹(shu)(shu)脂(zhi)(zhi)錫(xi)(xi)(xi)(xi)膏(gao)(gao)提(ti)供(gong)(gong)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)性的(de)(de)(de)(de)應(ying)用(yong)(yong)(yong)(yong)(yong)解決方案(an)，零(ling)(ling)助焊(han)(han)(han)劑(ji)殘(can)(can)留(liu)(liu)風險，用(yong)(yong)(yong)(yong)(yong)于(yu)(yu)高(gao)可(ke)(ke)(ke)(ke)靠(kao)(kao)性產品應(ying)用(yong)(yong)(yong)(yong)(yong)，替代傳統焊(han)(han)(han)錫(xi)(xi)(xi)(xi)膏(gao)(gao)。上(shang)(shang)(shang)(shang)海微(wei)(wei)聯(lian)(lian)與您分(fen)享免洗(xi)零(ling)(ling)殘(can)(can)留(liu)(liu)錫(xi)(xi)(xi)(xi)膏(gao)(gao)的(de)(de)(de)(de)重要性。河北免洗(xi)零(ling)(ling)殘(can)(can)留(liu)(liu)錫(xi)(xi)(xi)(xi)膏(gao)(gao)新報價

上海微聯(lian)與您分享免洗零(ling)殘(can)留錫(xi)膏(gao)對如今市場的影響。庫存免洗零(ling)殘(can)留錫(xi)膏(gao)生產

在生產中，較多(duo)的(de)(de)焊(han)(han)劑(ji)殘(can)(can)(can)渣(zha)常(chang)會(hui)導致(zhi)在要(yao)實(shi)行電(dian)接(jie)觸(chu)的(de)(de)金(jin)屬表層上(shang)有(you)過多(duo)的(de)(de)殘(can)(can)(can)留(liu)物(wu)覆蓋，這會(hui)妨礙電(dian)連接(jie)的(de)(de)建立，在電(dian)路密度(du)日益增(zeng)加的(de)(de)情況下，這個問(wen)(wen)題(ti)(ti)(ti)越發受(shou)到人們的(de)(de)關注。上(shang)海(hai)微(wei)聯樹(shu)脂錫(xi)(xi)膏提(ti)(ti)(ti)供無(wu)鉛合(he)金(jin)的(de)(de)解(jie)決方(fang)案，無(wu)助焊(han)(han)劑(ji)殘(can)(can)(can)留(liu)腐(fu)蝕(shi)，用(yong)(yong)于(yu)MiniLED封(feng)裝，用(yong)(yong)于(yu)Flipchip倒(dao)裝焊(han)(han)。上(shang)海(hai)微(wei)聯樹(shu)脂錫(xi)(xi)膏提(ti)(ti)(ti)供高可靠(kao)(kao)性的(de)(de)應(ying)(ying)用(yong)(yong)解(jie)決方(fang)案，零(ling)助焊(han)(han)劑(ji)殘(can)(can)(can)留(liu)風險，用(yong)(yong)于(yu)高可靠(kao)(kao)性產品應(ying)(ying)用(yong)(yong)，替代傳統焊(han)(han)錫(xi)(xi)膏。并且上(shang)海(hai)微(wei)聯的(de)(de)樹(shu)脂錫(xi)(xi)膏沒有(you)殘(can)(can)(can)留(liu)物(wu)腐(fu)蝕(shi)風險，低揮發性，適(shi)合(he)高可靠(kao)(kao)應(ying)(ying)用(yong)(yong)。上(shang)海(hai)微(wei)聯實(shi)業的(de)(de)錫(xi)(xi)膏的(de)(de)特點(dian)(dian)(dian)：1，適(shi)合(he)倒(dao)裝芯片焊(han)(han)接(jie)，SMT工(gong)藝和(he)其它焊(han)(han)接(jie)應(ying)(ying)用(yong)(yong)。2，多(duo)種合(he)金(jin)選擇，針對不同溫度(du)和(he)基材。3，解(jie)決焊(han)(han)點(dian)(dian)(dian)二(er)次融(rong)化問(wen)(wen)題(ti)(ti)(ti)。4，更(geng)高的(de)(de)焊(han)(han)點(dian)(dian)(dian)強度(du)和(he)焊(han)(han)點(dian)(dian)(dian)保(bao)護。5，解(jie)決空洞問(wen)(wen)題(ti)(ti)(ti)，殘(can)(can)(can)留(liu)問(wen)(wen)題(ti)(ti)(ti)，腐(fu)蝕(shi)問(wen)(wen)題(ti)(ti)(ti)。6，提(ti)(ti)(ti)供點(dian)(dian)(dian)膠和(he)印刷不同解(jie)決方(fang)案。庫存免洗零(ling)殘(can)(can)(can)留(liu)錫(xi)(xi)膏生產

本文來自沈陽喜納多(duo)采暖工(gong)程有(you)限公(gong)司：//zjlong.cn/Article/75b399655.html